E1M-AEN RoHS / REACH / POPs Declaration
1 Declaration
Alp Lab AB declares, on the basis of the component-supplier declarations
referenced in Section 6, that the E1M-AEN System-on-Module family
(E1M-AEN301 through E1M-AEN803, hardware revision R3) conforms to:
- EU RoHS 3 — Directive 2011/65/EU as amended by Delegated Directive (EU) 2015/863, restricting ten substances (Section 3);
- EU REACH — Regulation (EC) No 1907/2006, Article 33 (Substances of Very High Concern, Section 4);
- EU POPs — Regulation (EU) 2019/1021 on persistent organic pollutants (Section 5).
This document is Preliminary. The declaration above is finalised — and re-issued as Released and signed (Section 8) — only once every supplier declaration in Section 6 is confirmed on file for the applicable module revision. Until then it states Alp Lab's expected conformity based on standard catalogue-part compliance, not a warranted legal declaration.
2 Scope
This declaration covers the E1M-AEN family of System-on-Modules manufactured by
Alp Lab AB, across all seven MPN variants (E1M-AEN301/501/701/401/601/801/803),
which share a common E1M™ footprint and bill of materials differing only
in the Ensemble SoC variant and, for E1M-AEN803, the fitted external OSPI memories.
The declaration applies at the level of the assembled module as delivered. It covers all electrical components and the bare PCB, the assembly solder, and surface finishes. It does not extend to any carrier board, enclosure, cabling, or packaging supplied separately.
| Item | Value |
|---|---|
| Product family | E1M-AEN System-on-Module (-301 … -803) |
| Covered revisions | Module hardware revision R3 (see DS-AEN-001). |
| Assembly process | Pb-free SAC reflow (RoHS-compliant solder) |
| BOM basis | 230 fitted electrical placements, 61 unique line items, 23 suppliers (hardware revision R3, E1M-AEN803 population with both external memories fitted) |
| Issued by | Alp Lab AB |
3 RoHS 3 — Restricted Substances
The module conforms to Directive 2011/65/EU as amended by (EU) 2015/863. No restricted substance is intentionally present above its maximum concentration value in any homogeneous material, except where covered by an Annex III exemption invoked at the component level (Section 3.1).
| Restricted substance | Symbol | Max. conc. (wt% homogeneous) | Status |
|---|---|---|---|
| Lead | Pb | 0.1% | Conform |
| Mercury | Hg | 0.1% | Conform |
| Cadmium | Cd | 0.01% | Conform |
| Hexavalent chromium | Cr(VI) | 0.1% | Conform |
| Polybrominated biphenyls | PBB | 0.1% | Conform |
| Polybrominated diphenyl ethers | PBDE | 0.1% | Conform |
| Bis(2-ethylhexyl) phthalate | DEHP | 0.1% | Conform |
| Butyl benzyl phthalate | BBP | 0.1% | Conform |
| Dibutyl phthalate | DBP | 0.1% | Conform |
| Diisobutyl phthalate | DIBP | 0.1% | Conform |
3.1 Annex III Exemptions
Mainstream catalogue passives and ICs commonly rely on the following RoHS Annex III exemptions for lead in materials internal to the component (the module's assembly solder is Pb-free SAC). These are declared as potentially invoked pending each supplier's confirmation; they do not affect the module's RoHS-compliant status.
| Exemption | Scope | Likely component classes |
|---|---|---|
| 6(c) | Copper alloy containing up to 4% lead by weight | Connector contacts, component leads |
| 7(a) | Lead in high-melting-temperature solders (≥85% Pb) | Internal die/terminal solder in some ICs |
| 7(c)-I | Lead in dielectric/glass of ceramic & glass electronic components | MLCC capacitors, chip resistors |
| 15(a) | Lead in solder to complete a viable electrical connection between die and carrier within an IC package | BGA / QFN / WLCSP ICs |
4 REACH — Substances of Very High Concern
Under Regulation (EC) No 1907/2006 (REACH), Article 33, a supplier of an article must communicate any Substance of Very High Concern (SVHC) on the ECHA Candidate List present in that article above 0.1% by weight (w/w).
Based on the supplier declarations referenced in Section 6, no SVHC on the ECHA Candidate List (as last updated) is intentionally present above 0.1% w/w in the E1M-AEN module as delivered, and no safe-use information beyond normal electronic-assembly handling is required.
REACH is a moving target: the ECHA Candidate List is updated approximately twice yearly. This declaration is valid against the Candidate List revision in force at the issue date. Alp Lab re-evaluates against each Candidate List update; customers requiring a declaration against a specific list revision should request a re-issue.
5 POPs — Persistent Organic Pollutants
The module conforms to Regulation (EU) 2019/1021 on persistent organic pollutants. None of the substances restricted under that regulation — including short-chain chlorinated paraffins (SCCPs), perfluorooctane sulfonic acid (PFOS), perfluorooctanoic acid (PFOA) and its salts/related compounds, hexabromo- cyclododecane (HBCDD), and the restricted polybrominated diphenyl ethers — is intentionally added or present above the applicable concentration limits.
6 Basis of Declaration
This declaration is a roll-up of component-supplier declarations, not the result of analytical testing of the assembled module by Alp Lab. Conformity rests on the RoHS, REACH and (where applicable) POPs declarations obtained from the component manufacturers below, covering all 61 line items of the E1M-AEN R3 BOM.
| Manufacturer | Component classes supplied | Declaration |
|---|---|---|
| Texas Instruments | Regulators (including the nano-power LDOs), supervisor, Ethernet PHY, logic buffers, temperature sensor | Public · per-part |
| onsemi | EEPROM | Public · per-part |
| NXP Semiconductors | Level shifter | Public · per-part |
| Nexperia | MOSFETs | Pending |
| Renesas Electronics | Power-control IC | Pending |
| ISSI | OSPI NOR flash | Pending |
| Murata Electronics | MLCC capacitors | Public · per-part |
| TDK Corporation | MLCC capacitors | Public · per-part |
| KEMET | MLCC capacitor | Pending |
| Yageo | Chip resistors | Public · company |
| Samsung Electro-Mechanics | MLCC capacitors, inductors, R | Public · company |
| Taiyo Yuden | MLCC capacitor | Public · company |
| Winbond Electronics | HyperRAM | Public · company |
| Diodes Incorporated | Load switches | Public · company |
| Kinetic Technologies | LED driver | Public · company |
| Delta Electronics / Cyntec | Power inductor | Public · company |
| Würth Elektronik | Power inductors | Pending |
| Micro Crystal AG | RTC | Public · company |
| ECS Inc. | 32.768 kHz crystal | Public · company |
| Raltron Electronics | 38.4 MHz crystal | Public · company |
| KYOCERA AVX | 50 MHz oscillator | Public · company |
| Alif Semiconductor | Application SoC | On file · REC-001 r5 |
| BDE Technology | Wi-Fi / BLE module | Request · direct |
Declaration column: Public · per-part — supplier emits a signed
declaration for the exact part number via a self-service material-content tool;
Public · company — supplier publishes a company-level RoHS/REACH certificate
covering the part; On file · direct — supplier-issued declaration obtained
directly and filed; Request · direct — no declaration yet, obtained from the
supplier directly; Pending — supplier added in R3; declaration source not yet located. Suppliers that only provide parts not fitted in the standard build (the RTC backup supercapacitor, the second EEPROM, the CAN transceiver, the secure element and the RF connector J1, whose supplier I-PEX is an assembly-option supplier only) are not listed. The Alif row is now closed: REC-001 Certificate of Compliance,
Rev 5 certifies the FBGA/WLCSP Ensemble family as RoHS10-compliant, REACH-compliant
(SVHC candidate list ed. 4 Feb 2026), and Halogen-Free (IEC 61249-2-21). One
Request row remains open (BDE Wi-Fi/BLE module); the declaration is issued as
Released once it is closed and all PDFs are on file. Source locations are
maintained in the working index supplier-declarations-index.md.
7 Validity & Limitations
- Roll-up, not test. Conformity is asserted from component-supplier declarations, consistent with normal practice for electronic assemblies. Alp Lab does not perform XRF/ICP analytical verification of every lot.
- Per-revision issue. This declaration is issued per module revision; a BOM change (alternate part, second source) triggers re-evaluation and re-issue.
- Regulatory currency. RoHS exemptions expire and the REACH Candidate List grows; the declaration is valid against the regulatory state at the issue date.
- Scope boundary. Covers the module as delivered only — not carrier boards, enclosures, or separately-supplied accessories.
8 Authorisation
Signed for and on behalf of Alp Lab AB:
Signature: ______________________________
Name: ______________________________
Title: ______________________________
Date: ______________________________
Place: ______________________________
9 Revision History
| Revision | Changes | Date |
|---|---|---|
| 0.1 |
| June 2026 |
| 0.2 |
| June 2026 |
| 0.3 |
| July 2026 |
| 0.4 |
| October 2026 |
| 0.5 |
| October 2026 |