E1M-X V2N-M1 Conflict Minerals Declaration
1 Declaration
Alp Lab AB is committed to the responsible sourcing of tin, tantalum, tungsten and gold (3TG) used in the E1M-X V2N-M1 System-on-Module. Alp Lab's exposure is entirely downstream, through the electronic components in the module. Diligence is aligned with the OECD Due Diligence Guidance and the Responsible Minerals Initiative (RMI), reported via the RMI Conflict Minerals Reporting Template (CMRT).
2 Scope & Regulatory Framework
Covers the assembled E1M-X V2N-M1 module. Addresses conflict-minerals obligations under US Dodd-Frank §1502, EU Conflict Minerals Reg. (EU) 2017/821, the OECD Due Diligence Guidance, and the RMI CMRT / RMAP.
3 3TG Content Analysis
Derived from the released BOM (1303 placements, 98 line items) and the Pb-free SAC assembly.
| Mineral | Present | Primary source | Where in the module |
|---|---|---|---|
| Tin (Sn) | Yes | SAC solder + terminations | Assembly solder and tin-plated terminations of every placement — board-wide |
| Gold (Au) | Yes | Finishes + bond wires | IC/SoC/accelerator bond wires; BGA/QFN/WLCSP finishes; gold-plated connector contacts |
| Tungsten (W) | Trace | IC die metallization | Tungsten plugs/vias inside IC silicon; via supplier CMRT |
| Tantalum (Ta) | No | — | Not intentionally present — all decoupling is ceramic MLCC; no tantalum capacitors in the BOM |
Key simplification: the V2N-M1 contains no tantalum (all ceramic MLCC decoupling). The tantalum row is declared "not contained". Tin and gold are the materially-present 3TG; tungsten is trace. The lithium supercapacitor (RTC backup) and the LPDDR/flash/accelerator devices contain no tantalum.
4 Due-Diligence Approach
Alp Lab cascades the CMRT request to suppliers and aggregates declared smelters: collect a current RMI CMRT from each supplier (Section 5); aggregate the declared Sn/W/Au smelters; screen each against the RMI RMAP conformant-smelter list; report on the RMI CMRT XLSX, re-issued as data and the RMAP list change.
5 Supplier CMRT Collection Basis
The module smelter list is a roll-up of supplier CMRTs. Tantalum-only sources are not applicable (no tantalum). Every supplier is a potential tin source (terminations); IC/connector/SoC suppliers are gold sources.
| Manufacturer | Material 3TG | CMRT on file |
|---|---|---|
| Renesas | Sn, Au, W | Locate |
| DeepX | Sn, Ta, Au, W | On file · CMRT 6.5 |
| Micron Technology | Sn, Au, W | Locate |
| Texas Instruments | Sn, Au, W | Locate |
| Realtek | Sn, Au, W | Locate |
| Qorvo | Sn, Au, W | Locate |
| Macronix | Sn, Au, W | Locate |
| Winbond Electronics | Sn, Au, W | Locate |
| Kingston Technology | Sn, Au, W | Locate |
| Infineon | Sn, Au, W | Locate |
| GigaDevice | Sn, Au, W | Locate |
| Analog Devices | Sn, Au, W | Locate |
| Rohm Semiconductor | Sn, Au, W | Locate |
| Nexperia | Sn, Au, W | Locate |
| onsemi | Sn, Au, W | Locate |
| STMicroelectronics | Sn, Au, W | Locate |
| Toshiba Elec. Devices | Sn, Au, W | Locate |
| Diodes Incorporated | Sn, Au, W | Locate |
| Microchip Technology | Sn, Au, W | Locate |
| Kinetic Technologies | Sn, Au, W | Locate |
| Murata Electronics | Sn, Au | Locate |
| TDK Corporation | Sn, Au | Locate |
| Yageo / Vishay / AVX | Sn, Au | Locate |
| Samsung Electro-Mechanics | Sn, Au | Locate |
| Taiyo Yuden | Sn, Au | Locate |
| Würth Elektronik | Sn, Au | Locate |
| Abracon / TKD / ECS | Sn, Au | Locate |
| Micro Crystal / Seiko | Sn, Au | Locate |
| Samtec | Sn, Au | Locate |
| Delta / Cyntec | Sn, Au | Locate |
Most suppliers publish a company-level RMI CMRT on their compliance/CSR pages. The DeepX row is now closed: DeepX supplied a product-scoped RMI CMRT (template v6.5) for the DX-M1 covering all four 3TG, declaring ∼ 208 smelters/refiners and stating that all sourcing — including from covered countries or CAHRAs — is from RMAP-validated conformant smelters, plus an RMI EMRT (v2.1) for extended minerals (see Section 8). DeepX's IC-level CMRT covers tantalum as a standard full-3TG declaration; the module itself carries no tantalum capacitors, so tantalum remains not-intentionally-present at module level (any tantalum confined to trace IC die metallization). Sources maintained in supplier-cmrt-index.md.
6 Declaration Level
| Level | Description |
|---|---|
| Company (default) | A single Alp Lab AB CMRT across all products. Lower maintenance, recommended. |
| Product | A CMRT scoped to the V2N-M1 smelter roll-up. Available on request. |
7 Smelter / Refiner List
Pending supplier CMRT collection. The aggregated Sn/W/Au smelter list — each with its RMI Standard Smelter ID and RMAP conformance status — is populated here once the supplier CMRTs in Section 5 are received. The tantalum section is declared not contained.
8 Extended Minerals (EMRT)
Beyond 3TG, the RMI Extended Minerals Reporting Template (EMRT) covers cobalt and mica (and, in v2.1, copper, lithium, nickel). These are relevant to the V2N-M1 through its LPDDR/eMMC devices, PMICs, and the lithium RTC-backup supercapacitor. DeepX supplied an RMI EMRT (v2.1) for the DX-M1 declaring cobalt, copper, mica and nickel present (lithium not present), with due diligence ongoing on a portion of the mica sub-tier supply chain. Alp Lab aggregates supplier EMRTs alongside the CMRTs; the module-level extended-minerals roll-up is issued with the smelter list.
9 Limitations
- Downstream declaration — only as complete as the supplier CMRTs aggregated.
- Per-revision / periodic re-issue — on BOM change and as RMAP/CMRTs update.
- XLSX is the formal artifact — this document is the companion statement.
10 Authorisation
Signed for and on behalf of Alp Lab AB:
Signature: ______________________
Name: ______________________
Title: ______________________
Date: ______________________
Place: ______________________
11 Revision History
| Revision | Changes | Date |
|---|---|---|
| 0.1 |
| June 2026 |
| 0.2 |
| July 2026 |
| 0.3 |
| October 2026 |