E1M-X V2N Conflict Minerals Declaration

E1M-X V2N Conflict Minerals Declaration

3TG due diligence — CMRT companion statement

Document

CM-V2N-001

Revision

0.2

Date

October 2026

Status

Preliminary

Download PDFrev 0.2Latest revision

1 Declaration

Conflict Minerals Declaration

Alp Lab AB is committed to the responsible sourcing of tin, tantalum, tungsten and gold (3TG) used in the E1M-X V2N System-on-Module (base variant). Alp Lab's exposure is entirely downstream, through the electronic components in the module. Diligence is aligned with the OECD Due Diligence Guidance and the Responsible Minerals Initiative (RMI), reported via the RMI Conflict Minerals Reporting Template (CMRT).

Status of this issue:

Preliminary. The 3TG content analysis (Section 3) is complete from the BOM. The smelter list (Section 7) and the customer-facing CMRT XLSX are finalised once the supplier CMRTs in Section 5 are collected and rolled up.

2 Scope & Regulatory Framework

Covers the assembled E1M-X V2N module (base variant). Addresses conflict-minerals obligations under US Dodd-Frank §1502, EU Conflict Minerals Reg. (EU) 2017/821, the OECD Due Diligence Guidance, and the RMI CMRT / RMAP.

3 3TG Content Analysis

Derived from the released BOM and the Pb-free SAC assembly.

Table 1 3TG presence in the E1M-X V2N module

Mineral	Present	Primary source	Where in the module
Tin (Sn)	Yes	SAC solder + terminations	Assembly solder and tin-plated terminations of every placement — board-wide
Gold (Au)	Yes	Finishes + bond wires	IC/SoC bond wires; BGA/QFN/WLCSP finishes; gold-plated connector contacts
Tungsten (W)	Trace	IC die metallization	Tungsten plugs/vias inside IC silicon; via supplier CMRT
Tantalum (Ta)	No	—	Not intentionally present — all decoupling is ceramic MLCC; no tantalum capacitors in the BOM

Note:

Key simplification: the V2N contains no tantalum (all ceramic MLCC decoupling). The tantalum row is declared "not contained". Tin and gold are the materially-present 3TG; tungsten is trace. The lithium supercapacitor (RTC backup) and the LPDDR/flash devices contain no tantalum.

4 Due-Diligence Approach

Alp Lab cascades the CMRT request to suppliers and aggregates declared smelters: collect a current RMI CMRT from each supplier (Section 5); aggregate the declared Sn/W/Au smelters; screen each against the RMI RMAP conformant-smelter list; report on the RMI CMRT XLSX, re-issued as data and the RMAP list change.

5 Supplier CMRT Collection Basis

The module smelter list is a roll-up of supplier CMRTs. Tantalum-only sources are not applicable (no tantalum). Every supplier is a potential tin source; IC/SoC/ connector suppliers are gold sources.

Table 2 Component-supplier CMRT collection tracker

Manufacturer	Material 3TG	CMRT on file
Renesas	Sn, Au, W	Locate
Micron Technology	Sn, Au, W	Locate
Texas Instruments	Sn, Au, W	Locate
Realtek	Sn, Au, W	Locate
Qorvo	Sn, Au, W	Locate
Macronix	Sn, Au, W	Locate
Winbond Electronics	Sn, Au, W	Locate
Kingston Technology	Sn, Au, W	Locate
Infineon	Sn, Au, W	Locate
GigaDevice	Sn, Au, W	Locate
Analog Devices	Sn, Au, W	Locate
Rohm Semiconductor	Sn, Au, W	Locate
Nexperia	Sn, Au, W	Locate
onsemi	Sn, Au, W	Locate
STMicroelectronics	Sn, Au, W	Locate
Toshiba Elec. Devices	Sn, Au, W	Locate
Diodes Incorporated	Sn, Au, W	Locate
Microchip Technology	Sn, Au, W	Locate
Kinetic Technologies	Sn, Au, W	Locate
Murata Electronics	Sn, Au	Locate
TDK Corporation	Sn, Au	Locate
Yageo / Vishay / AVX	Sn, Au	Locate
Samsung Electro-Mechanics	Sn, Au	Locate
Taiyo Yuden	Sn, Au	Locate
Würth Elektronik	Sn, Au	Locate
Abracon / TKD / ECS	Sn, Au	Locate
Micro Crystal / Seiko	Sn, Au	Locate
Samtec	Sn, Au	Locate
Delta / Cyntec	Sn, Au	Locate

Note:

Most suppliers publish a company-level RMI CMRT on their compliance/CSR pages. Sources maintained in supplier-cmrt-index.md.

6 Declaration Level

Table 3 CMRT declaration options

Level	Description
Company (default)	A single Alp Lab AB CMRT across all products. Lower maintenance, recommended.
Product	A CMRT scoped to the V2N smelter roll-up. Available on request.

7 Smelter / Refiner List

Note:

Pending supplier CMRT collection. The aggregated Sn/W/Au smelter list — each with its RMI Standard Smelter ID and RMAP conformance status — is populated here once the supplier CMRTs in Section 5 are received. The tantalum section is declared not contained.

8 Limitations

1. Downstream declaration — only as complete as the supplier CMRTs aggregated.
2. Per-revision / periodic re-issue — on BOM change and as RMAP/CMRTs update.
3. XLSX is the formal artifact — this document is the companion statement.

9 Authorisation

Signed for and on behalf of Alp Lab AB:

Signature: ______________________

Name: ______________________

Title: ______________________

Date: ______________________

Place: ______________________

10 Revision History

Table 4 Document revision history

Revision	Changes	Date
0.1	Initial preliminary declaration with BOM-derived 3TG content analysis (no tantalum; Sn/Au material, W trace) and the supplier CMRT collection tracker. Awaiting CMRTs and smelter roll-up.	June 2026
0.2	Release history: every entry formatted as a bullet list.	October 2026