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E1M-X V2N RoHS / REACH / POPs Declaration

1 Declaration​

Declaration of Conformity

Alp Lab AB declares, on the basis of the component-supplier declarations referenced in Section 6, that the E1M-X V2N System-on-Module (Renesas RZ/V2N, base variant, all production revisions) conforms to:

  • EU RoHS 3 — Directive 2011/65/EU as amended by (EU) 2015/863 (Section 3);
  • EU REACH — Regulation (EC) No 1907/2006, Article 33 (SVHC, Section 4);
  • EU POPs — Regulation (EU) 2019/1021 (Section 5).
Status of this issue:

Preliminary. Finalised and signed (Section 8) only once every supplier declaration in Section 6 is confirmed on file. Until then it states Alp Lab's expected conformity from standard catalogue-part compliance, not a warranted legal declaration.

2 Scope​

Covers the assembled E1M-X V2N module (base variant, Pb-free SAC assembly). The V2N-M1 variant (with the DeepX accelerator) is covered by DC-V2NM1-001.

Table 1 Declaration coverage
ItemValue
ProductE1M-X V2N System-on-Module (base)
Assembly processPb-free SAC reflow (RoHS-compliant solder)
BOM basis∼ 1180 placements, ∼ 95 line items, 34 suppliers
Issued byAlp Lab AB

3 RoHS 3 — Restricted Substances​

Conforms to 2011/65/EU as amended by (EU) 2015/863. No restricted substance is intentionally present above its maximum concentration value in any homogeneous material, except where covered by an Annex III exemption at component level.

Table 2 RoHS 3 restricted substances and maximum concentration values
Restricted substanceSymbolMax. (wt% homog.)Status
LeadPb0.1%Conform
MercuryHg0.1%Conform
CadmiumCd0.01%Conform
Hexavalent chromiumCr(VI)0.1%Conform
Polybrominated biphenylsPBB0.1%Conform
Polybrominated diphenyl ethersPBDE0.1%Conform
Bis(2-ethylhexyl) phthalateDEHP0.1%Conform
Butyl benzyl phthalateBBP0.1%Conform
Dibutyl phthalateDBP0.1%Conform
Diisobutyl phthalateDIBP0.1%Conform

Common Annex III exemptions potentially invoked at component level (the module's assembly solder is Pb-free SAC): 6(c) lead in copper alloy; 7(a) lead in high-melting solders; 7(c)-I lead in dielectric/glass of ceramic components; 15(a) lead in die/carrier solder within IC packages.

4 REACH — Substances of Very High Concern​

Based on the supplier declarations in Section 6, no SVHC on the ECHA Candidate List (as last updated) is intentionally present above 0.1% w/w in the module as delivered.

Note:

The ECHA Candidate List is updated ∼ twice yearly; this declaration is valid against the revision in force at the issue date.

5 POPs — Persistent Organic Pollutants​

Conforms to Regulation (EU) 2019/1021. None of the restricted POPs — SCCPs, PFOS, PFOA and related compounds, HBCDD, and the restricted PBDEs — is intentionally added or present above the applicable limits.

6 Basis of Declaration​

A roll-up of component-supplier declarations (not analytical testing). Conformity rests on the declarations from the manufacturers below.

Table 3 Component-supplier compliance basis (declaration tracker)
ManufacturerKey component classesDeclaration
Texas InstrumentsBucks, CAN, mux, temp, logicPublic · filed
Murata ElectronicsMLCCs, ferrites, Wi-Fi modulePublic · filed
TDK CorporationMLCCsPublic · filed
YageoChip resistorsPublic · filed
Winbond ElectronicsSPI NAND flashPublic · filed
Diodes IncorporatedLoad switchPublic · filed
Microchip TechnologyClock bufferPublic · filed
SamtecRF connectorPublic · filed
RenesasRZ/V2N SoC, DA9292 PMIC, clock genPublic · locate
Micron TechnologyLPDDR4 DRAMPublic · locate
RealtekEthernet PHY (×2)Public · locate
MacronixOSPI NOR flashPublic · located
Kingston TechnologyeMMCPublic · locate
QorvoMulti-output PMICPublic · locate
Rohm SemiconductorLoad switchesPublic · locate
NexperiaLevel shifter, TVSPublic · locate
Analog DevicesRTC (MAX31331)Public · locate
GigaDeviceCompanion MCUPublic · locate
InfineonSecure elementPublic · locate
STMicroelectronicsEEPROMPublic · located
onsemiEEPROM, LDO, NS5A4684Public · located
Toshiba Elec. DevicesLoad switches, LDOPublic · located
Samsung Electro-MechanicsMLCCs, inductorsPublic · located
Taiyo YudenMLCCs, ferritesPublic · located
Vishay DaleResistorsPublic · locate
Würth ElektronikInductors/magneticsPublic · locate
AVXCapacitorsPublic · locate
AbraconCrystalsPublic · locate
TKDCrystalsPublic · locate
ECS Inc.CrystalsPublic · located
Micro Crystal AGRTCPublic · located
Seiko InstrumentsSupercapacitorPublic · locate
Kinetic TechnologiesLED driverPublic · located
Delta Electronics / CyntecPower inductorPublic · located
Note:

filed — PDF in the OneDrive evidence folder (shared with E1M-AEN where the supplier is common); located — public source identified, retrieve by MPN; locate — vendor publishes, exact PDF not yet pulled. All suppliers publish a public declaration; the declaration is issued Released once all PDFs are on file and the signatory has signed. Sources in supplier-declarations-index.md.

7 Validity & Limitations​

  1. Roll-up, not test — asserted from supplier declarations.
  2. Per-revision issue — a BOM change triggers re-evaluation and re-issue.
  3. Regulatory currency — valid against the RoHS exemption / REACH Candidate List state at the issue date.
  4. Scope boundary — module as delivered only.

8 Authorisation​

Signed for and on behalf of Alp Lab AB:

Signature: ______________________

Name: ______________________

Title: ______________________

Date: ______________________

Place: ______________________

9 Revision History​

Table 4 Document revision history
RevisionChangesDate
0.1
  • Initial preliminary declaration from the released E1M-X V2N BOM (base variant, 34 suppliers).
  • 8 suppliers filed (shared with E1M-AEN).
  • Awaiting remaining declarations and signature.
June 2026
0.2
  • Release history: every entry formatted as a bullet list.
October 2026
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