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Carrier Board Design Guide

This guide provides recommendations for designing custom carrier boards that interface with Alp Lab E1M Edge AI modules through the SODIMM connector.

Overview

E1M modules are designed as system-on-module (SoM) products that plug into application-specific carrier boards. The carrier board provides:

  • Power regulation and distribution
  • Physical connectors (USB, Ethernet, camera, display)
  • Application-specific circuitry (sensor interfaces, motor drivers, etc.)
  • Mechanical mounting and enclosure integration

SODIMM Connector Placement

Keepout Zones

Maintain the following clearances around the SODIMM connector:

  • Above connector: Clearance for the E1M module height (5 mm minimum)
  • Around connector: Clearance for insertion/removal

Mounting

Power Supply Design

Input Power Requirements

RailVoltageTypical CurrentNotes
VCC_3V33.3V--Main module power supply
VCC_1V81.8V--I/O power supply

Decoupling

Place bulk and high-frequency decoupling capacitors close to the SODIMM connector power pins:

  • Bulk: 100 uF electrolytic or polymer per power rail
  • High-frequency: 100 nF + 1 uF MLCC per power pin group

Power Sequencing

Signal Routing Guidelines

High-Speed Signals

For MIPI CSI-2, MIPI DSI, USB 3.0, and Ethernet signals:

  • Route as differential pairs with controlled impedance (100 ohm differential)
  • Minimize stub lengths
  • Length-match within differential pairs to within 0.1 mm
  • Use ground-referenced stripline or microstrip

SPI / I2C / UART

Standard digital interfaces can be routed as single-ended traces:

  • Keep trace lengths under 150 mm
  • Add series termination resistors (22-33 ohm) on clock lines if needed
  • Pull-up resistors for I2C: 2.2k to 4.7k ohm to VCC_3V3

GPIO

  • Maximum load capacitance per GPIO pin: 15 pF
  • Drive strength is configurable via the ALP SDK

Reference Designs

Alp Lab provides reference carrier board designs for evaluation and as starting points for custom designs. Contact your Alp Lab representative for access to reference design files.

Design Review Checklist

Before sending your carrier board design to fabrication, verify the following:

  • SODIMM connector footprint matches the recommended land pattern
  • All power rails are present and properly decoupled
  • Power sequencing requirements are met
  • High-speed differential pairs are impedance-controlled and length-matched
  • Keepout zones around the SODIMM connector are respected
  • ESD protection is present on all externally-accessible connectors
  • Thermal management is adequate for the target environment